Bishop and Associates, Inc. has just released a new 15 chapter research report providing a complete analysis of Evolving High-Speed Connectors. This new report details backplane, midplane, and mezzanine connectors as well as high-speed backplane cable assemblies. Connector values are provided for each category for the years 2004, 2005, 2006, and 2010, as well as each region of the world. The market for high-speed connectors has experienced extensive changes over the past two years from both the technology, as well as business perspectives. This report includes background information on the evolution of high-speed circuits and connectors, and includes data on key electrical and mechanical characteristics for each of the leading interfaces on the market today. The influences of printed circuit board designs, materials, and advanced silicon chips on multigigabit circuit performance are reviewed. Advances in circuit modeling and simulation along with performance testing methods are also covered. Common applications as well as the future direction of the market is discussed along with statistical data on market size and forecasts by bandwidth, end user, and region of the world. |
