Table of Contents: Connector Technology Roadmap Report
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Report Overview
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O-1: Report Purpose & Contents
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O-2: Connector Overview
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O-3: Roadmap Definition, Industry Trends, & Outsourcing
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O-4: Major Trends
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O-5: Critical Areas for North America
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O-6: Key Areas inferred from NEMI Roadmap
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O-8: Acknowledgements
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Technology Roadmap Process
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1-1: Roadmapping Discipline
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1-4: Early Roadmapping Proponents - Intel Example
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1-5: Example - IC Substrate Roadmap
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1-6: Outline for a Connector Roadmap
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1-7: Example - Memory Socket Roadmap & Roadmap Manuscript from Sandia Labs
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Connector Technology Review
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2-1: Introduction & Separable vs. Hard Connections
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2-2: Transition to Electronic Component
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2-3: Key Areas for Connector Development & Roadblocks
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2-4: High performance Packaging Impact
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2-5: Parallel to Serial Busses
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2-6: Generic High Speed Roadmap
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2-7: Contact Physics
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2-8: Micro-Contacts & Base Metals
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2-9: Contacts & Plating
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2-10: Plastics
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2-11: Manufacturing & Assembly
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2-12: Mfg Summary & Final Word
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Connector Roadmap Overview & Market
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3-1: Scope, Definition, & Market
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3-2: Worldwide Connector Sales
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3-3: North American Decline in Mfg.
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3-4: Key Dynamics
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3-5: Summary of Possible Actions & of Connector Trends by Type
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3-7: Connector Trends Table & Other Key Points
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3-9: Connector Background & Definition
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3-11: Connector Applications Illustration
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3-12: Share by Market & Outsourcing Phenomenon
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3-13: Barriers to North American Mfg
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3-14: World Connector Market Forecast Scenarios 2003 - 2013
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3-15: World and Regional Connector Market Roadmap 2002 - 2013
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Connector Technology Roadmap
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4-1: Electro-Mechanical Connection
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4-2: Transition to Electronics & General Roadmap Trend
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4-3: Key Technology Roadblocks
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4-4: Parallel to Serial
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4-5: Precursor to Fiber & Generic High Speed Roadmap
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4-6: High Speed Barriers
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4-7: Micro-Contacts & MEMS
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4-8: Base Metals & Metal Fabrication
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4-9: Plating Technology
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4-10: Substrate & Tim Plating & Precious Metal
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4-11: Pb-Free Soldering & Pb-Free Alloys
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4-12: Lubricants & Polymers
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4-13: Manufacturing, Insert Molding, & Dual Injection Molding
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4-14: Connector Assembly
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4-15: Major Trends & Odd-Shape Component Placement
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4-16: Automation
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4-17: Automation Definitions
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4-18: Automation Levels & Philosophy of Automation
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4-19: Historical Model & Influence of Outsourcing
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4-20: China Manufacturing & Electronic Assembly by Region
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4-21: China Mfg by Market Segment 2001 - 2006
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4-22: Mfg Summary
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Connector Roadmaps
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5-1: Generic PC Board Connectors
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5-2: Connectorized Backplanes
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5-3 Characteristic Impedance
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5-4: Moore' Law & Differential Signaling
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5-5: Skin Effect & High Speed Connector Impact
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5-6: Connector Density by Type & Speed vs. Density
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5-8: Performance Meaurement Systems - Near End Cross-Talk, TDR, & S-Parameters
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5-9: Eye Plots, Spice Analysis, 3D Field Solvers, & Test Boards
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5-10: Software, Test Documentation, & Effects of Telecome & IT Downturn
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5-11: Connector Attachment Technology & Board Designs for Press-Fit
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5-13: Through Hole B/P Board Size & Aspect Ratios
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5-14: Surface Finishes, Press-Fit Limitations, Limits of Technology
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5-15: PWB Materials
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5-16: GHz Speeds
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5-18: Common B/P Architectures & Traditional
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5-19: Card Cage
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5-20: Mid-Plane & Orthogonal
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5-21: Industry Standards
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5-22: Industry Stds. Backplanes
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5-23: Surface Mount
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5-24: Limits to Introduction of New Technology
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5-27: Emerging Technology - Beyond 10GHz
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5-28: Adaptive Equalizers & Driver & Receiver Technology
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5-30: Market Forecast Gb Backplane Connectors
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5-32: Shift to Offshore Mfg
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5-31: Optical Backplane Systems, Discrete Fiber, Polymer Waveguides, Flexible Glass, & Barriers to Implementation
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5-33: Connectorized B/P Roadmap & Power Connectors
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5-34: Anatomy of a Power Contact
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5-37: Power Connector Performance Criteria
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5-38: Hot Swap Performance
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5-39: Power Categories, Power Capacity, Configuration, Form Factor, & Ratings
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5-41: Parameter Roadmap & Power/Heat Reduction Efforts
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5-42: Thermal Management
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5-43: Bus Bars
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