Bishop And Associates
Section: Connector Roadmaps
Part of the Full Report: Connector Technology Roadmap Report

Price: $950.00
Delivery: Immediate Online Access
Publication Date: 01-JUN-03

Format: PDF document  PDF Electronic Document
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Section Description

This is one section of an extensive study prepared by Bishop & Associates, Inc. "Connector Technology Roadmap Report."



Report Hierarchy
» Full Report: Connector Technology Roadmap Report
» Section: Connector Roadmaps
» Section: 5-1: Generic PC Board Connectors
» Section: 5-2: Connectorized Backplanes
» Section: 5-3 Characteristic Impedance
» Section: 5-4: Moore' Law & Differential Signaling
» Section: 5-5: Skin Effect & High Speed Connector Impact
» Section: 5-6: Connector Density by Type & Speed vs. Density
» Section: 5-8: Performance Meaurement Systems - Near End Cross-Talk, TDR, & S-Parameters
» Section: 5-9: Eye Plots, Spice Analysis, 3D Field Solvers, & Test Boards
» Section: 5-10: Software, Test Documentation, & Effects of Telecome & IT Downturn
» Section: 5-11: Connector Attachment Technology & Board Designs for Press-Fit
» Section: 5-13: Through Hole B/P Board Size & Aspect Ratios
» Section: 5-14: Surface Finishes, Press-Fit Limitations, Limits of Technology
» Section: 5-15: PWB Materials
» Section: 5-16: GHz Speeds
» Section: 5-18: Common B/P Architectures & Traditional
» Section: 5-19: Card Cage
» Section: 5-20: Mid-Plane & Orthogonal
» Section: 5-21: Industry Standards
» Section: 5-22: Industry Stds. Backplanes
» Section: 5-23: Surface Mount
» Section: 5-24: Limits to Introduction of New Technology
» Section: 5-27: Emerging Technology - Beyond 10GHz
» Section: 5-28: Adaptive Equalizers & Driver & Receiver Technology
» Section: 5-30: Market Forecast Gb Backplane Connectors
» Section: 5-32: Shift to Offshore Mfg
» Section: 5-31: Optical Backplane Systems, Discrete Fiber, Polymer Waveguides, Flexible Glass, & Barriers to Implementation
» Section: 5-33: Connectorized B/P Roadmap & Power Connectors
» Section: 5-34: Anatomy of a Power Contact
» Section: 5-37: Power Connector Performance Criteria
» Section: 5-38: Hot Swap Performance
» Section: 5-39: Power Categories, Power Capacity, Configuration, Form Factor, & Ratings
» Section: 5-41: Parameter Roadmap & Power/Heat Reduction Efforts
» Section: 5-42: Thermal Management
» Section: 5-43: Bus Bars
» Section: 5-44:: World Forecast of Electronic Power Connectors 2002 - 2007
» Section: 5-45: Mezzanine Connectors
» Section: 5-46: High Performance Stacking Connector Roadmap
» Section: 5-47: Rt. Angle High Perf. Stacking Connector Roadmap
» Section: 5-48: IC Sockets
» Section: 5-50: PGA Sockets & PGA Barriers
» Section: 5-51: LGA Sockets & LGA Barriers
» Section: 5-52: Universal Socket Technology
» Section: 5-54: Memory Sockets
» Section: 5-55: Memory Socket Roadmap & Memory Socket Barriers
» Section: 5-56: Test & Burn-In Connectors
» Section: 5-57: Multiple Package Test, Wafer Scale, Pad Pitches, & Burn-In
» Section: 5-58: Key Points

Keywords: electronic, market, information, industry, equipment, blocks, research, terminal

 

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Research Reports
The Bishop Report
Connector Industry Yearbook

About Bishop & Associates, Inc.

Bishop & Associates, Inc. is a market research firm specializing in the global electronic connector market.The firm publishes a monthly newsletter entitled The Bishop Report, and an annual review of the connector industry, The Connector Industry Yearbook. In addition, Bishop & Associates produces many off-the-shelf market studies analyzing regional and global markets, connector products, and technology.

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Tel: (630) 443-2702    Fax: (603) 443-2704