5-9: Eye Plots, Spice Analysis, 3D Field Solvers, & Test Boards - Connector Technology Roadmap Report - Market Size, Market Share and Demand Forecast;

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5-9: Eye Plots, Spice Analysis, 3D Field Solvers, & Test Boards

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electronic market, connector market, global market, Bishop report, connector industry forecast, terminal blocks, High speed backplane, filtered connectors, world telecom market, computer equipment, connector manufacturers, automotive connector market, connector technology roadmap, power connectors, Bishop and associates

Publication Date: 01-JUN-03
Format: PDF
Price: $35.00
Delivery: Immediate Online Access

Description

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This is a section of the Full Report:

Connector Technology Roadmap Report

Publication Date: 01-JUN-03
Format: PDF
Price: $2,950.00
Delivery: Immediate Online Access

Description
Bishop and Associates has released a new six chapter, 183-page report covering technology roadmapping on electronic connectors. Included with the Bishop Connector Roadmap report is the National Electronic Manufacturing Initiative's (NEMI1) 2002 Electronics Industry Roadmap on CD (1,100 pages).
During 2002, Bishop and Associates, Inc. worked with other industry experts to research and author a connector roadmap that became part of the National Electronic Manufacturing Initiative's 2002 Technology Roadmap Report.
Covered in the new report is a 10-year roadmap of selected elements of the electronic connector industry from 2003 to 2013, a review of connector technology trends, and a discussion of the roadmapping process. It contains PCB Connectors, backplane connectors, processor and memory test sockets power connectors, high-speed connectors, etc. It also includes an interpretation of the NEMI roadmaps' impact on connectors. The intent is to expand on this data for future reports, adding additional product categories, industry segment analyses, and support for the 2004 NEMI roadmap process.
The Connector Technology Roadmap Report includes insights into outsourcing to EMS, ODM and other subcontractors, and the move to high volume system manufacturing to China. It discusses how these dynamics will affect the connector industry, which is also increasing its presence in China to maintain customers and remain competitive. Questions emerge about the future of western manufacturing and RD&E infrastructure that supports these high volume markets. This is affecting standard product manufacturing and supply chains such as mobile phones and PDAs, notebook and desktop computers and PC motherboards, PC servers, computer peripherals, telecom equipment, etc. Even the increasingly competitive automotive sector will be subject to these trends.

Purchase Options

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Report Overview (PDF document -- $100.00)

O-1: Report Purpose & Contents (PDF document -- $30.00)

O-2: Connector Overview (PDF document -- $30.00)

O-3: Roadmap Definition, Industry Trends, & Outsourcing (PDF document -- $30.00)

O-4: Major Trends (PDF document -- $30.00)

O-5: Critical Areas for North America (PDF document -- $30.00)

O-6: Key Areas inferred from NEMI Roadmap (PDF document -- $30.00)

O-8: Acknowledgements (PDF document -- $30.00)

Technology Roadmap Process (PDF document -- $675.00)

1-1: Roadmapping Discipline (PDF document -- $220.00)

1-4: Early Roadmapping Proponents - Intel Example (PDF document -- $220.00)

1-5: Example - IC Substrate Roadmap (PDF document -- $220.00)

1-6: Outline for a Connector Roadmap (PDF document -- $220.00)

1-7: Example - Memory Socket Roadmap & Roadmap Manuscript from Sandia Labs (PDF document -- $220.00)

Connector Technology Review (PDF document -- $250.00)

2-1: Introduction & Separable vs. Hard Connections (PDF document -- $35.00)

2-2: Transition to Electronic Component (PDF document -- $35.00)

2-3: Key Areas for Connector Development & Roadblocks (PDF document -- $35.00)

2-4: High performance Packaging Impact (PDF document -- $35.00)

2-5: Parallel to Serial Busses (PDF document -- $35.00)

2-6: Generic High Speed Roadmap (PDF document -- $35.00)

2-7: Contact Physics (PDF document -- $35.00)

2-8: Micro-Contacts & Base Metals (PDF document -- $35.00)

2-9: Contacts & Plating (PDF document -- $35.00)

2-10: Plastics (PDF document -- $35.00)

2-11: Manufacturing & Assembly (PDF document -- $35.00)

2-12: Mfg Summary & Final Word (PDF document -- $35.00)

Connector Roadmap Overview & Market (PDF document -- $500.00)

3-1: Scope, Definition, & Market (PDF document -- $70.00)

3-2: Worldwide Connector Sales (PDF document -- $70.00)

3-3: North American Decline in Mfg. (PDF document -- $70.00)

3-4: Key Dynamics (PDF document -- $70.00)

3-5: Summary of Possible Actions & of Connector Trends by Type (PDF document -- $70.00)

3-7: Connector Trends Table & Other Key Points (PDF document -- $70.00)

3-9: Connector Background & Definition (PDF document -- $70.00)

3-11: Connector Applications Illustration (PDF document -- $70.00)

3-12: Share by Market & Outsourcing Phenomenon (PDF document -- $70.00)

3-13: Barriers to North American Mfg (PDF document -- $70.00)

3-14: World Connector Market Forecast Scenarios 2003 - 2013 (PDF document -- $70.00)

3-15: World and Regional Connector Market Roadmap 2002 - 2013 (PDF document -- $70.00)

Connector Technology Roadmap (PDF document -- $600.00)

4-1: Electro-Mechanical Connection (PDF document -- $50.00)

4-2: Transition to Electronics & General Roadmap Trend (PDF document -- $50.00)

4-3: Key Technology Roadblocks (PDF document -- $50.00)

4-4: Parallel to Serial (PDF document -- $50.00)

4-5: Precursor to Fiber & Generic High Speed Roadmap (PDF document -- $50.00)

4-6: High Speed Barriers (PDF document -- $50.00)

4-7: Micro-Contacts & MEMS (PDF document -- $50.00)

4-8: Base Metals & Metal Fabrication (PDF document -- $50.00)

4-9: Plating Technology (PDF document -- $50.00)

4-10: Substrate & Tim Plating & Precious Metal (PDF document -- $50.00)

4-11: Pb-Free Soldering & Pb-Free Alloys (PDF document -- $50.00)

4-12: Lubricants & Polymers (PDF document -- $50.00)

4-13: Manufacturing, Insert Molding, & Dual Injection Molding (PDF document -- $50.00)

4-14: Connector Assembly (PDF document -- $50.00)

4-15: Major Trends & Odd-Shape Component Placement (PDF document -- $50.00)

4-16: Automation (PDF document -- $50.00)

4-17: Automation Definitions (PDF document -- $50.00)

4-18: Automation Levels & Philosophy of Automation (PDF document -- $50.00)

4-19: Historical Model & Influence of Outsourcing (PDF document -- $50.00)

4-20: China Manufacturing & Electronic Assembly by Region (PDF document -- $50.00)

4-21: China Mfg by Market Segment 2001 - 2006 (PDF document -- $50.00)

4-22: Mfg Summary (PDF document -- $50.00)

Connector Roadmaps (PDF document -- $950.00)

5-1: Generic PC Board Connectors (PDF document -- $35.00)

5-2: Connectorized Backplanes (PDF document -- $35.00)

5-3 Characteristic Impedance (PDF document -- $35.00)

5-4: Moore' Law & Differential Signaling (PDF document -- $35.00)

5-5: Skin Effect & High Speed Connector Impact (PDF document -- $35.00)

5-6: Connector Density by Type & Speed vs. Density (PDF document -- $35.00)

5-8: Performance Meaurement Systems - Near End Cross-Talk, TDR, & S-Parameters (PDF document -- $35.00)

5-9: Eye Plots, Spice Analysis, 3D Field Solvers, & Test Boards (PDF document -- $35.00)

5-10: Software, Test Documentation, & Effects of Telecome & IT Downturn (PDF document -- $35.00)

5-11: Connector Attachment Technology & Board Designs for Press-Fit (PDF document -- $35.00)

5-13: Through Hole B/P Board Size & Aspect Ratios (PDF document -- $35.00)

5-14: Surface Finishes, Press-Fit Limitations, Limits of Technology (PDF document -- $35.00)

5-15: PWB Materials (PDF document -- $35.00)

5-16: GHz Speeds (PDF document -- $35.00)

5-18: Common B/P Architectures & Traditional (PDF document -- $35.00)

5-19: Card Cage (PDF document -- $35.00)

5-20: Mid-Plane & Orthogonal (PDF document -- $35.00)

5-21: Industry Standards (PDF document -- $35.00)

5-22: Industry Stds. Backplanes (PDF document -- $35.00)

5-23: Surface Mount (PDF document -- $35.00)

5-24: Limits to Introduction of New Technology (PDF document -- $35.00)

5-27: Emerging Technology - Beyond 10GHz (PDF document -- $35.00)

5-28: Adaptive Equalizers & Driver & Receiver Technology (PDF document -- $35.00)

5-30: Market Forecast Gb Backplane Connectors (PDF document -- $35.00)

5-32: Shift to Offshore Mfg (PDF document -- $35.00)

5-31: Optical Backplane Systems, Discrete Fiber, Polymer Waveguides, Flexible Glass, & Barriers to Implementation (PDF document -- $35.00)

5-33: Connectorized B/P Roadmap & Power Connectors (PDF document -- $35.00)

5-34: Anatomy of a Power Contact (PDF document -- $35.00)

5-37: Power Connector Performance Criteria (PDF document -- $35.00)

5-38: Hot Swap Performance (PDF document -- $35.00)

5-39: Power Categories, Power Capacity, Configuration, Form Factor, & Ratings (PDF document -- $35.00)

5-41: Parameter Roadmap & Power/Heat Reduction Efforts (PDF document -- $35.00)

5-42: Thermal Management (PDF document -- $35.00)

5-43: Bus Bars (PDF document -- $35.00)

5-44:: World Forecast of Electronic Power Connectors 2002 - 2007 (PDF document -- $35.00)

5-45: Mezzanine Connectors (PDF document -- $35.00)

5-46: High Performance Stacking Connector Roadmap (PDF document -- $35.00)

5-47: Rt. Angle High Perf. Stacking Connector Roadmap (PDF document -- $35.00)

5-48: IC Sockets (PDF document -- $35.00)

5-50: PGA Sockets & PGA Barriers (PDF document -- $35.00)

5-51: LGA Sockets & LGA Barriers (PDF document -- $35.00)

5-52: Universal Socket Technology (PDF document -- $35.00)

5-54: Memory Sockets (PDF document -- $35.00)

5-55: Memory Socket Roadmap & Memory Socket Barriers (PDF document -- $35.00)

5-56: Test & Burn-In Connectors (PDF document -- $35.00)

5-57: Multiple Package Test, Wafer Scale, Pad Pitches, & Burn-In (PDF document -- $35.00)

5-58: Key Points (PDF document -- $35.00)

NEMI Roadmap Trends (PDF document -- $850.00)

6-1: Automotive & Defense Systems (PDF document -- $60.00)

6-2: Board Assembly (PDF document -- $60.00)

6-3: Consumer Electronics (PDF document -- $60.00)

6-4: Si Chip-Package Roadmap & Displays (PDF document -- $60.00)

6-5: Market Shares of Various Display Technologies (PDF document -- $60.00)

6-6: Energy Storage (PDF document -- $60.00)

6-7: Battery Applications, Environmental Electronics, & Final Assembly (PDF document -- $60.00)

6-8: Needs from NEMI Analysis of Final Assembly & Interconnect Substrates (PDF document -- $60.00)

6-9: PWB Manufacturing (PDF document -- $60.00)

6-10: Inorganic Substrates & LTCC Substrates (PDF document -- $60.00)

6-12: Large Business Systems (PDF document -- $60.00)

6-13: Mass Data Storage & World Market - Disk Drives (PDF document -- $60.00)

6-15: Modeling, Simulation & Design Rules (PDF document -- $60.00)

6-16: Electro-Optics (PDF document -- $60.00)

6-17: Optical Module Revenue (PDF document -- $60.00)

6-18: Conceptual EO Packaging (PDF document -- $60.00)

6-19: Packaging (PDF document -- $60.00)

6-20: Peripheral Bus Speed & Package IO Count (PDF document -- $60.00)

6-21: Passive Devices (PDF document -- $60.00)

6-22: IPD Usage +/- (PDF document -- $60.00)

6-23: Portable Products (PDF document -- $60.00)

6-24: Key Parameters for Handheld Devices & RF Components (PDF document -- $60.00)

6-26: Thermodynamics (PDF document -- $60.00)

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5-9: Eye Plots, Spice Analysis, 3D Field Solvers, & Test Boards - Connector Technology Roadmap Report - Market Size, Market Share and Demand Forecast;